Finally, my briefing ended today. Today for the first time I enter the place I am suppose to work, Failure Analysis Lab under Quality & Reliability Department.
My supervisor introduced me to all the staffs in the lab and brief me on each function of the machines and devices . Being expose to those machines, it was like ‘WOW, Engineering ROCKS..!!’ Hehe..
I started on the first procedure of my individual project today. I put in 30 WLCSP ( Wafer Level Chip Scale Package ) into the oven to stress it. These die are very tiny that I need to inspect it under a very high power microscope. More to learn tomorrow on grinding, polishing, I-V curve tracer…
But one thing, we are not allowed to snap pictures inside the company plant !! Gosh ! What I have to attach in my report and presentation later?? It can’t be all words…. If use curi snap.. I am too timid to do that, what if I got caught and terminated? OH NO ! I don’t want to retain one year….. Hope I will get the permit to snap some pictures for my report purpose.. <-@-@->.
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