As promised by our Department Head... we trainee got the opportunity to tour down at the production line for us to understand the process of IC packaging. Lucky for me, as it expose me to something out from my project. My project is related to solder bump package and this tour is related to wire bond package. Internship is not about jus completing your project but also some exposure to the industrial. Thats the purpose of internship.
As i know quite a number of people in my batch joined the semiconductor company... Freescale, Infineon,.... and mine - Fairchild. At least, my housemates and I are in semiconductor company for our internship.
I learned and read about the process in slides during my first week of my internship, but I didnt understand well until I went for this tour. Before going in the production floor, the strictly no ESD area, we put on this "bunny suit", booties, and face mask.
The overall process of semicondutor production is as below :
Wafer Fabrication -> Wafer sort -> Dicing -> Die attach -> Wire Bonding -> Molding -> Deflash -> Plating -> Trim & Form -> Testing -> Mark -> Tape & Reel - Boxstock
Interesting and beneficial tour around my company... will jot down in logbook..
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